Debonding
Assembly Line
Photonic debonding provides a more cost-efficient, higher-throughput debond process
There are many different ways to separate a thinned wafer from its temporary carrier substrate, also known as debonding. A critical challenge in this process is minimizing damage to the thinned wafers. Because each method has a different mechanism for debonding, it’s important to consider the application, material properties of the thinned wafer, and downstream processes. Click the icons to learn about the five most common debonding methods: thermal slide, mechanical debonding, chemical debonding, laser debonding, and photonic debonding.
Photonic debonding is an ideal choice for wafer processors who seek to minimize cost, while achieving a clean debond process. Its scalability in wafer sizes, resistance to warped substrates, and tunability make it exceptionally versatile. The main consideration when electing to do a photonic debond process is to consider your material needs. You must ensure your materials have compatible adhesive properties and an optimized light-absorbing layer. For example, BrewerBOND® 305 material as an adhesive enables thinning to 50 µm, while only requiring a low-residue cleaning process enabling reuse of the carrier.